Heating pump system
US12427837B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 2, 2022 |
| Grant date | Sep 30, 2025 |
| Priority date | — |
| Expiry date | Dec 19, 2043 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF25B2400/04
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
A heat pump system for a motor vehicle is disclosed. The heat pump system includes a refrigerant circuit that is flowable through by a refrigerant. The refrigerant circuit has a first partial circuit with a low pressure accumulator, a compressor, a heat pump heater, and an exterior heat exchanger. The refrigerant circuit has a second partial circuit with an evaporator and a chiller. The refrigerant circuit has a valve arrangement. The first partial circuit and the second partial circuit are fluidically connected with one another exclusively via the valve arrangement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.