Patent · US Active

Fluid deposition system and method

US12428846B2 · kind B2 · utility

0Cited by
2References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 8, 2020
Grant dateSep 30, 2025
Priority date
Expiry dateSep 8, 2040

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH02S40/12
  • WIPO fieldCivil engineering
  • WIPO sectorOther fields

Abstract

A fluid deposition system is provided. The system comprises one or more electronic processors, and one or more electronic memories each electrically connected to at least one of the one or more processors and having instructions stored therein. The processor(s) is/are configured to access the memory or memories and execute the instructions stored therein such that the processor(s) is/are configured to: determine whether one or more predetermined criteria are met for initiating deposition of fluid onto an area of interest; when it is determined that the criteria is/are met, determine one or more operating parameters of the fluid deposition system to use in the deposition of the fluid onto the area of interest; and following the determination of the operating parameter(s), generate one or more electrical signals to cause the fluid to be deposited onto the area of interest in accordance with the determined parameter(s).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.