Electrical bonding door hinges
US12428888B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2024 |
| Grant date | Sep 30, 2025 |
| Priority date | — |
| Expiry date | Feb 2, 2044 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE05Y2900/132
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A hinge assembly includes first and second hinge units and an electrically conductive pin. The first hinge unit is mounted to a door of an enclosure and includes a pin support comprising a barrel, a knuckle, or both, a pin receptacle arranged and rotatable in the pin support, and an electrically conductive structure disposed at least partly inside the pin support and adjacent the pin receptacle. The second hinge unit is carried on the pin and is mountable to a frame structure. The second hinge unit can be removed from the first hinge unit to enable removal of the door. The electrically conductive structure is biased against the pin, remains in contact while the pin rotates, and is electrically connected to the door as the pin rotates while the first hinge unit remains mounted to the door.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.