AI accelerator integrated circuit chip with integrated cell-based fabric adapter
US12430547B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2024 |
| Grant date | Sep 30, 2025 |
| Priority date | — |
| Expiry date | Dec 20, 2044 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F15/17331
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An integrated circuit formed on (i) a single semiconductor die or (ii) a plurality semiconductor dies that are integrated into a single package. The integrated circuit may include a communication interface including a serializer/deserializer (SerDes) interface; a fabric adapter communicatively coupled to the communication interface; a plurality of inference engine clusters, each inference engine cluster including a respective memory element and/or memory interface; and a data interconnect communicatively coupling each respective memory element and/or memory interfaces of the plurality of inference engine clusters to the fabric adapter. The fabric adapter may be configured to facilitate remote direct memory access (RDMA) read and write services and/or datagram communication over a cell-based switch fabric to and from the respective memory elements and/or memory interfaces of the plurality of inference engine clusters via the data interconnect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.