Method for detecting a surface defect of a copper-clad laminate based on multi-scale gridding
US12430750B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 5, 2024 |
| Grant date | Sep 30, 2025 |
| Priority date | — |
| Expiry date | Jul 5, 2044 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/30
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Provided is a method for detecting a surface defect of a copper-clad laminate based on multi-scale gridding. The method includes: S1, collecting a photographed image of the copper-clad laminate through a line-scan camera; S2, segmenting out a copper-clad region and a non-copper-clad region, and rotating the copper-clad region upright; S3, dividing the copper-clad region of the image of the copper-clad laminate, and performing a pyramid operation on a divided original grid image; S4, determining averages of pixel values at all levels; S5, fusing the average at all levels to obtain a final background average; and S6, searching for a final defect according to a difference between a background and a foreground.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.