Integrated wafer debonding and cleaning apparatus and debonding and cleaning method
US12431382B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2023 |
| Grant date | Sep 30, 2025 |
| Priority date | — |
| Expiry date | Mar 5, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68381
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated wafer debonding and cleaning apparatus and a debonding and cleaning method are provided. The integrated wafer debonding and cleaning apparatus includes an input port, a debonding module, a wafer cleaning device, and a transport device. The input port is configured to allow a substrate to be processed to enter the integrated wafer debonding and cleaning apparatus. The substrate to be processed includes a wafer and a carrier which are bonded. The debonding module is configured to debond the substrate to be processed, and to separate the wafer from the carrier. The wafer cleaning apparatus is configured to clean the wafer. The transport device is configured to transfer the substrate to be processed, the wafer, and the carrier. The debonding module and the wafer cleaning module are integrated in one apparatus for continuous processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.