Bonded body, circuit board, semiconductor device, and method for manufacturing bonded body
US12431406B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Dec 27, 2022 |
| Grant date | Sep 30, 2025 |
| Priority date | — |
| Expiry date | Jul 21, 2043 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2237/407
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A bonded body according to an embodiment comprises a ceramic substrate, a copper plate, and a bonding layer provided on at least one surface of the ceramic substrate and bonding the ceramic substrate and the copper plate, in which the bonding layer contains Cu, Ti, and a first element being one or two selected from Sn and In, and the bonding layer includes a Ti-rich region in which a ratio (MTi/ME1) of a mass MTi of Ti to a mass ME1 of the first element being 0.5 or more and a Ti-poor region in which the ratio (MTi/ME1) being 0.1 or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.