Flip-chip bonding structure and circuit board thereof
US12432849B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2023 |
| Grant date | Sep 30, 2025 |
| Priority date | — |
| Expiry date | Sep 20, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10893
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flip-chip bonding structure includes a chip and a circuit board, the chip is bonded to the circuit board by bumps. The circuit board includes a light-transmissive substrate, a first circuit group, a second circuit group, a boundary circuit and an identifying member. The boundary circuit is located between the first and second circuit groups and projects a boundary circuit shadow on light-transmissive substrate. The boundary circuit shadow can be recognized according to the identifying member and is provided to identify the boundary between the first and second circuit groups or identify the position of leads with the smallest pitch.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.