Polymeric cold plate for thermal management of power electronics
US12432877B2 · kind B2 · utility
0Cited by
9References
14Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 14, 2023 |
| Grant date | Sep 30, 2025 |
| Priority date | — |
| Expiry date | Feb 14, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20772
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A power electronic assembly includes a power electronic and a cold plate. The power electronic is configured to be powered by electric energy and to generate waste heat from the electric energy. The cold plate include polymeric material and is configured to elastically deform to uniformly cover the power electronic and transfer away the waste heat generated by the power electronic.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.