Electrode connection structure and method of forming the same
US12433144B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 3, 2022 |
| Grant date | Sep 30, 2025 |
| Priority date | — |
| Expiry date | Feb 18, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/1201
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electrode connection structure is provided and includes a substrate, a first electrode, a second electrode, a semiconductor layer, a third electrode, and a conductive block. The first electrode and the second electrode are located on the substrate. The semiconductor layer is located on the first electrode and the second electrode. The third electrode is on the semiconductor layer. The conductive block penetrates through the semiconductor layer and the third electrode and directly contacts the second electrode and the third electrode. A first upper surface of the conductive block and a second upper surface of the third electrode are in different planes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.