Method and apparatus for selective burnout trimming of integrated circuit units

US3930304A · kind A · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Helmut Keller · Eningen unter Achalm, DE
• Hartmut Seiler · Reutlingen, DE

Key dates

• Filing date: Nov 15, 1973
• Grant date: Jan 6, 1976
• Expiry date: Nov 15, 1993

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S148/055
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Supplementary metallized connection parts short-circuiting or connecting incremental sub-components of one or more circuit elements of an integrated circuit are laid down on the semiconductor slice at the same time as the usual metallized connection pattern is made. The components associated with the incremental sub-components are measured to determine the program of adjustment and selective burnout of the supplementary connections. The selective burnout is carried out by applying a sequence of pulses to the segments to be burned out under monitoring by a measuring circuit, which blocks the delivery of further pulses, either immediately or after one or a few more pulses, when the measuring circuit detects the opening of the connection. The process is preferably carried out on integrated circuits before the semiconductor slice on which they are made is separated into individual circuit units. The pulses are applied in sequences in which individual pulses or series of pulses have increasing amplitude and/or pulse duration and/or pulse frequency.