Resist process
US3930857A · kind A · utility
27Cited by
7References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 3, 1973 |
| Grant date | Jan 6, 1976 |
| Priority date | — |
| Expiry date | May 3, 1993 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/98
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A resist mask, whose configuration is changed during processing, is formed by varying the exposure energy across a resist layer and then conducting successive development steps using developers having increasing solvent power to remove progressively more of the resist layer with each step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.