Process for coating substrates with high molecular weight epoxy resins
US3931109A · kind A · utility
56Cited by
3References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 8, 1974 |
| Grant date | Jan 6, 1976 |
| Priority date | — |
| Expiry date | Mar 8, 1994 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S524/923
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Substrates are coated with relatively high molecular weight epoxy resin coatings by applying to a substrate a mixture comprising: PA1 A. a relatively low molecular weight epoxy resin such as the diglycidyl ether of bisphenol A, PA1 B. a phenolic hydroxyl-containing compound such as bisphenol A and PA1 C. a catalyst for effecting a reaction between (A) and (B), and Subjecting the coated substrate to a temperature of 120.degree. to 300.degree.C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.