Method of electrically interconnecting semiconductor elements
US3932226A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 6, 1974 |
| Grant date | Jan 13, 1976 |
| Priority date | — |
| Expiry date | Dec 6, 1994 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved method of electrically interconnecting a plurality of spaced semiconductor elements adjacent to a substrate, each element having a mesa shape with a top surface spaced apart from the substrate and a side surface, includes coating the side surfaces of the elements with a protective material, filling in the space above the substrate and in between the elements with a temporary support material, depositing a continuous electrically-conductive layer on the support material and in electrical contact with the top surfaces of a plurality of the elements, and then removing the temporary support material to form an electrically-conductive homogeneous air-bridge. The protective material protects the elements from being exposed to the temporary support material. By this method, a plurality of metallized air-bridges can be formed simultaneously.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.