Pre-treatment method for electroless plating for producing a metal film as resistor
US3932694A · kind A · utility
23Cited by
6References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 4, 1974 |
| Grant date | Jan 13, 1976 |
| Priority date | — |
| Expiry date | Apr 4, 1994 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/181
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A pre-treatment method for electroless plating of metal film resistors is provided. Said method is characterized in that a stabilized and uniform activating film is formed on the base material to be plated by sequential treatment of said base material with a stannous chloride (SnCl.sub.2) solution, a silver salt solution, a second stannous chloride solution and a palladium, a palladium chloride (PdCl.sub.2) solution. The resultant alloy film has improved resistance to exfoliation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.