Pattern plate device for vacuum sealed molding
US3933194A · kind A · utility
4Cited by
1References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 26, 1974 |
| Grant date | Jan 20, 1976 |
| Priority date | — |
| Expiry date | Jul 26, 1994 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22C7/04
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A pattern plate device for vacuum sealed molding, being applied with a negative pressure to the surfaces of said device, covered with a flexible film on said surfaces tightly, on which a molding flask having a reducing structure is set, and then being used for performing a vacuum sealed molding operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.