Method of etching copper and copper alloys
US3933544A · kind A · utility
7Cited by
4References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 6, 1973 |
| Grant date | Jan 20, 1976 |
| Priority date | — |
| Expiry date | Aug 6, 1993 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23F1/46
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of etching copper and copper alloys by means of an ammoniacal etching solution containing chloride ions and for regenerating this etching solution during this etching process by adding an ammoniacal compound, for example, in the form of ammonium hydroxide or ammonia gas, as well as hydrochloric acid and water to the etching solution in accordance with continuous measurements of the pH-value and the specific gravity of the etching solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.