Palladium electroplating bath, process, and preparation
US3933602A · kind A · utility
24Cited by
7References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 19, 1974 |
| Grant date | Jan 20, 1976 |
| Priority date | — |
| Expiry date | Apr 19, 1994 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/567
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed is an aqueous plating bath suitable for obtaining electrodeposits of palladium and its alloys. The bath is substantially free of cyanide, nitrate and nitrite, and comprises sulfite ion, palladium in the form of a tetra-coordinated complex with palladium in the +2 oxidation state, an atomic ratio of halide to palladium not in excess of 10, and exhibits a pH of from 7 to 12.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.