Electroless metal plating

US3934054A · kind A · utility

Assignee

• Electro Chemical Engineering GmbH · CH

Inventors

• Edith L. Schmeling · Brühl, DE
• Herbert Friebe, deceased · Cologne, DE
• Ulrich Reininghaus

Key dates

• Filing date: Dec 3, 1973
• Grant date: Jan 20, 1976
• Expiry date: Dec 3, 1993

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C23C18/1619
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A method and apparatus for electroless plating of a metal on a workpiece overcomes the problem of metal plating on solid particles suspended in the solution and on those parts of the plating apparatus in contact with the solution by maintaining a concentration of anticatalytic substance, such as lead ions, between about 10.sup.-.sup.6 and 10.sup..sup.-1 mols per liter and maintaining a relative speed of more than about 0.9 meter per second between the solution and those parts of the apparatus in contact with the solution.