Ceramic circuit board mounted in housing and method of fabrication thereof
US3934074A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 22, 1974 |
| Grant date | Jan 20, 1976 |
| Priority date | — |
| Expiry date | Apr 22, 1994 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is an electrical circuit board structure incorporating a ceramic substrate wafer and metallic mounting means bonded to the substrate wafer for securing the structure to a housing. The metallic portion of the structure protects the ceramic wafer from mechanical stresses transmitted through the housing by providing structural integrity and dynamic isolation. Selection of such a metallic material having its coefficient of thermal expansion similar to that of the substrate material prevents the creation of thermal stresses between the ceramic and the metal portion of the structure. The disclosed method comprises rigidly securing the ceramic substrate circuit board to the metallic member in such a way that the latter may be attached to the housing without stressing the ceramic material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.