Electroless deposition of a copper-nickel alloy on an imagewise pattern of physically developable metal nuclei
US3935013A · kind A · utility
11Cited by
6References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 12, 1973 |
| Grant date | Jan 27, 1976 |
| Priority date | — |
| Expiry date | Nov 12, 1993 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03C5/58
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A physical developer composition for latent images comprises a mixture of at least one copper salt and at least one nickel salt and a reducing agent for copper and nickel salts wherein the nickel and copper salts are in such proportions that upon reduction to a metal alloy, the alloy contains from 9 to 98 mole percent copper and from 2 to 91 mole percent nickel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.