ABS resin composition
US3935143A · kind A · utility
3Cited by
5References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 16, 1973 |
| Grant date | Jan 27, 1976 |
| Priority date | — |
| Expiry date | Apr 16, 1993 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/0008
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An ABS resin composition is disclosed, adapted for rotational molding (rotocasting), which comprises an ABS resin of from minus 10 to plus 100 mesh size particles having uniformly dispersed and adhered to the surface of the particles an organic compound of a particle size of minus 100 mesh having a melting point of 100.degree.C to 250.degree.C and a decomposition point above 200.degree.C, the weight ratio of resin to organic compound being 100 to 0.1 - 5.0.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.