Process for preparing a metallized resin film for condenser element
US3935334A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 21, 1974 |
| Grant date | Jan 27, 1976 |
| Priority date | — |
| Expiry date | Jun 21, 1994 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G13/06
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A process for providing a margin in a metallized resin film for a condenser element which is characterized by providing on a dielectric resinous layer a water-soluble coating layer having a pattern corresponding to a margin pattern, providing a metal deposition layer on the resinous layer including a coated part and a non-coated part and removing the water-soluble coating layer and the metal deposition layer thereon by washing with water. According to the process, a metallized resin film having an arbitrary margin pattern and a superior electrical property can be readily obtained, with completely eliminating any complexity of the procedure and disadvantage in conventional processes for providing a margin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.