Method for the production of material for printed circuits and material for printed circuits
US3936548A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 27, 1974 |
| Grant date | Feb 3, 1976 |
| Priority date | — |
| Expiry date | Feb 27, 1994 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0726
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for the production of a material for printed circuits is disclosed. A temporary base is coated by electroplating with a thin, unbroken and unpatterned metallic layer having a thickness less than 17 .mu.m and the free surface of said metallic layer is bonded to a final insulating base. The temporary base is thereafter removed and the desired wiring pattern is produced by a process comprising etching of the metal layer. A material for use in production of printed circuits is also disclosed comprising a temporary base which is coated by electroplating with a thin, unbroken and unpatterned metal layer having a thickness less than 17 .mu.m. Said material can comprise a final, insulating base bonded to the free surface of the thin metal layer. The temporary base may be comprised of an aluminum foil coated with a layer of zinc or an aluminum foil to which has been applied zinc and which has the zinc replaced electrochemically by half or partly, by a layer of a metal which is more electro-positive than the metal zinc. In electroplating a thin, unbroken and unpatterned metallic layer onto the temporary base the electroplating takes place in a solution containing copper, pryophospha…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.