Flow molding means and method
US3937774A · kind A · utility
11Cited by
6References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 1973 |
| Grant date | Feb 10, 1976 |
| Priority date | — |
| Expiry date | Oct 31, 1993 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/505
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Thermosetting molds are formed with electrically conductive surfaces for use in high frequency energy flow molding of sheet materials. Preferably the mold of this invention has a highly electrically conductive layer preferably in an epoxy gel coat carrying electrically conductive particles of gold, silver or platinum and positioned over a compatible epoxy mold body. A vacuum molding technique is used to obtain good surface definition in surface molding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.