Catalyst for electroless deposition of metals
US3937857A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 22, 1974 |
| Grant date | Feb 10, 1976 |
| Priority date | — |
| Expiry date | Jul 22, 1994 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12569
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A solvent method for the metallization of a non-conductive surface with gold, nickel or copper is shown whereby on a substrate a thermosensitive coordination complex of palladium is deposited; the complex has the formula LmPdXn wherein L is a ligand or unsaturated organic radical, X is a halide, alkyl group or a bidentate ligand and m is an integer from 1 to 4 and n is from 0 to 3; trimethyl phosphite palladium dichloride complex is an appropriate illustration of the complex; the palladium complex is applied on the substrate in a suitable non-aqueous solution such as tetrahydrofuran solution; the complex is then baked in air at elevated temperature; the exposure to high temperature decomposes the complex leaving a residue which is catalytic to the deposition of gold, nickel, cobalt or copper from an electroless bath thereof; the non-conductive material is then immersed in an electroless bath to metallize the areas which have been rendered catalytic; the preferred thermosensitive coordination complex of palladium is trimethyl phosphite palladium dichloride; a requirement for a proper thermal exposure of the complex is that the substrate is capable of withstanding the elevated temper…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.