Ultrasonic thermal compression beam lead, flip chip bonder
US3938722A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 30, 1973 |
| Grant date | Feb 17, 1976 |
| Priority date | — |
| Expiry date | Apr 30, 1993 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K20/106
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for bonding beam lead devices and flip chip devices onto mating conductive surfaces on a substrate or other surface and for bonding electrical leads to semiconductor devices and subsequently to mating conductive surfaces on a substrate or other surface, utilizing either thermocompression or ultrasonic energy. The bonding system of this disclosure includes a novel bonding tool having minute spherically shaped bonding surfaces which are caused by a novel pivoting mechanism to individually and successively bond each of a plurality of electrical leads in a complex wobbling motion which permits the bonding surfaces to trace an adjustable rectangular or other predetermined linear path around the periphery of the device. The system also includes a frequency modulated ultrasonic generator and a novel lead composite, developed for this apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.