Wire bonder
US3941486A · kind A · utility
16Cited by
6References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 3, 1974 |
| Grant date | Mar 2, 1976 |
| Priority date | — |
| Expiry date | Jun 3, 1994 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A thermocompression, tailless wire bonder which permits the bonding operation to take place at any location along the path of the bonding tool without affecting the length of wire protruding below the bonding tool or the location of the end of the wire relative to the torch. A non-frictional wire tensioning device is employed to produce a constant and adjustable tension on the bonding wire. A virtual image, parallax free, optical positioning system is utilized to position the bonding tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.