Related to the manufacture of lead frames and the mounting of semiconductor devices thereon
US3942245A · kind A · utility
93Cited by
5References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 3, 1974 |
| Grant date | Mar 9, 1976 |
| Priority date | — |
| Expiry date | Apr 3, 1994 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A support for a semiconductor device comprises a lead frame having a matrix of cranked conductors, which may be on an insulating substrate, with a recess being defined within the lead frame, the arrangement being such that by merely placing a correctly oriented device in the recess, and providing the required electrical interconnections between the device and the conductors, the device is accurately located in its required position on the lead frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.