Bonding apparatus
US3943323A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 23, 1974 |
| Grant date | Mar 9, 1976 |
| Priority date | — |
| Expiry date | Aug 23, 1994 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K20/025
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A bonding head for connecting the electrically conductive leads of a tape cable or the like to other electrical conductors. The bonding head, which applies heat and pressure to the electrical conductors and leads to bond them together, is an elongated member comprised of a material having high mechanical strength but low thermal conductivity which contains a conduit comprised of a material having low mechanical strength but high thermal conductivity. A heating element inserted in the conduit supplies heat to the conduit and bonding head. This arrangement provides a bonding head having a high mechanical strength and hence structural failure and deformation of the bonding head is reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.