Adhesive composition
US3944516A · kind A · utility
7Cited by
3References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 7, 1975 |
| Grant date | Mar 16, 1976 |
| Priority date | — |
| Expiry date | Apr 7, 1995 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/54
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed is a hot-melt adhesive composition comprised of an admixture of a polyetherester, polystyrene and optionally a filler. The adhesive composition exhibits a desirable overall balance of properties, including good bond strength, particularly after aging. In a preferred embodiment, the adhesive composition can be used to bond poly(vinyl chloride) to wood or particleboard.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.