Method for joining resistive and conductive materials
US3944777A · kind A · utility
Inventor
Key dates
| Filing date | Dec 13, 1974 |
| Grant date | Mar 16, 1976 |
| Priority date | — |
| Expiry date | Dec 13, 1994 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/328
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for joining, by molecular diffusion, an element of greater electrical resistance to a surface of substantially lesser electrical resistance. A piece of resistive material capable of being spot welded to the element of greater electrical resistance is placed in contact with both the surface having substantially lesser electrical resistance and the element having the greater electrical resistance. The resistive piece and the resistive element are spot welded to each other, whereby the heat from that spot weld causes the conductive material to be joined to the piece of resistive material by molecular diffusion. The method is particularly useful for joining nichrome wire to copper-clad printed circuit boards and for joining metal fasteners to copper and aluminum sheet metal surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.