Island assembly employing cooling means for high density integrated circuit packaging
US3946276A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 9, 1974 |
| Grant date | Mar 23, 1976 |
| Priority date | — |
| Expiry date | Oct 9, 1994 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/58
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system is described which provides for high density packaging of electronic equipment, particularly data processing systems. Subnanosecond integrated circuits of the LSI or MSI type in pluggable packages are adapted to be installed in receptacles or connectors. A cooling frame is provided which supports the package connectors as well as the package-to-package interconnection medium. In accordance with the system, groups of integrated circuit packages logically partitioned into functional elements and having, for example, gate complexities of the order of four thousand to ten thousand gates, comprise an island. The system may be expanded further by interconnecting several islands.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.