Method of depositing a metal on a surface
US3950570A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 2, 1974 |
| Grant date | Apr 13, 1976 |
| Priority date | — |
| Expiry date | May 2, 1994 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03C1/725
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of depositing a metal on a surface of a substrate is disclosed. A surface of the substrate is sensitized with a photosensitive sensitizer comprising a photosensitive species of (1) an element selected from Ni, Mn, U, Mo and W, or (2) a combination of elements comprising Pd and an element selected from In and Ce. The sensitized surface is exposed to a suitable source of radiation, e.g., ultraviolet radiation, to delineate a surface pattern, corresponding to a desired metal pattern, containing a species of at least one selected element which is either (1) capable of reducing an activation metal ion to catalytic activating metal or (2) capable of being reduced to a catalytic activating metal such as catalytic palladium. The ultraviolet radiation-delineated surface pattern is then exposed or treated with a solution comprising an activating metal ion to reduce and deposit thereon an activating metal. The deposited activating metal pattern is then exposed, as by immersion, to a suitable electroless metal deposition solution wherein an electroless metal is catalytically reduced on the activating metal pattern. However, where Pd-In, Pd-Ce sensitizers are employed, exposure to an a…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.