Leadless package receptacle
US3951495A · kind A · utility
48Cited by
5References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 23, 1974 |
| Grant date | Apr 20, 1976 |
| Priority date | — |
| Expiry date | Sep 23, 1994 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1069
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A leadless package receptacle for packaging and mounting electronic devices. The receptacle retains a plurality of spring contacts for soldering to a printed circuit board in a conventional manner and disposed within the receptacle to yieldably engage the lower surface of the package. The chip carrier has a plurality of conductive areas on the lower surface thereof for engaging the spring contacts and further has edge regions cooperatively disposed with respect to locking members on the receptacle for retaining the package in the receptacle. A mounting and removal tool is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.