Temperature compensated acoustic surface wave device
US3952268A · kind A · utility
13Cited by
4References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 29, 1974 |
| Grant date | Apr 20, 1976 |
| Priority date | — |
| Expiry date | Jul 29, 1994 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/145
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A temperature compensated acoustic surface wave device, such as a surface wave delay line is provided in which temperature compensation is provided by the deposition of an interdigital electrode structure on a substrate with an overlay film surface of piezoelectric material of a predetermined thickness. A double substrate arrangement is also disclosed in which the interdigital electrode structure is deposited upon the surface of a non-piezo-electric layer which in turn is placed upon the surface of a piezoelectric substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.