Low temperature curing adhesives
US3953544A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 10, 1974 |
| Grant date | Apr 27, 1976 |
| Priority date | — |
| Expiry date | May 10, 1994 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/14
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A low temperature curing polymeric adhesive composition may be made by reacting an amino alcohol having between 1 and 3 amino groups and between 2 and 5 hydroxyl groups with a stoichiometric amount of a carboxylic acid or derivative. Free radical catalysts and accelerators may be added to speed the cure of the adhesive. These adhesive resins can be cured at or near ambient room temperature and are highly desired for fabrication of bonded materials possessing long fatigue life because of reduced stresses that might be induced at higher cure temperatures. A generalized formula may be illustrated as follows: ##EQU1## WHERE R" may be hydrogen, alkyl, or cycloalkyl; R' may be hydrogen or alkyl; R is an alkyl; R.sub.1 may be hydrogen, an alkyl, or phenyl; m is an integer from 1 to 3; and n is an integer from 1 to 2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.