Method and apparatus for bonding and breaking leads to semiconductors
US3954217A · kind A · utility
17Cited by
2References
37Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 30, 1974 |
| Grant date | May 4, 1976 |
| Priority date | — |
| Expiry date | Sep 30, 1994 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01082
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The second wire bond is made in a semiconductor circuit simultaneously with breaking of the wire, in such manner that a "tailless" wirebond is achieved in minimum time and with no damage to either the wire or the bonding pad. The bond is made ultrasonically, and tension is applied to the wire during the actual time that ultrasonic bonding energy is supplied to the bonding tool. Such tension is applied by a spring or its equivalent, and is so predetermined that application of the bonding energy to the bonding tool will not only create the ultrasonic bond but will also break the wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.