Method of making perforated vinyl film ceiling board
US3954540A · kind A · utility
3Cited by
3References
1Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 25, 1974 |
| Grant date | May 4, 1976 |
| Priority date | — |
| Expiry date | Feb 25, 1994 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24331
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A standard fiber composition ceiling board is provided with an outer laminate of plasticized vinyl film. The holes in the film are smaller than the holes in the fiber composition ceiling board. The product is made by laminating the vinyl film to the ceiling board, then perforating the film and the ceiling board with pin punches. The perforations in the board stay at the size at which they are formed, while the holes in the film shrink in size.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.