Method of manufacturing a low energy-loss waveguide circuit element
US3955274A · kind A · utility
2Cited by
6References
5Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Dec 30, 1974 |
| Grant date | May 11, 1976 |
| Priority date | — |
| Expiry date | Dec 30, 1994 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49016
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of manufacturing low energy-loss waveguide circuit elements in which a film of metal with low resistivity is laid on the surface of a base metal and a hard metal die of a desired shape is pressed into the base metal through the metal film, so that a plastic strain is caused in the base metal thereby to form a recessed portion in the base metal, while at the same time welding the metal film to the base metal to cover the internal surface of the recessed portion with the metal film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.