Heat transfer device
US3955619A · kind A · utility
5Cited by
4References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 11, 1974 |
| Grant date | May 11, 1976 |
| Priority date | — |
| Expiry date | Mar 11, 1994 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28D15/046
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
In a heat pipe the portion of the wicking material which receives the liquid condensed at the condenser surface at the heat output end of the heat pipe is provided with a plurality of large openings extending from the surface adjacent the condenser surface to the opposing surface thereof to avoid condensate accumulation adjacent the condensation surface. Such accumulation blocks access of the condensation surface to vapor and hence increases the thermal impedance of the heat output end of the heat pipe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.