Contactless test method for integrated circuits
US3956698A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 12, 1974 |
| Grant date | May 11, 1976 |
| Priority date | — |
| Expiry date | Feb 12, 1994 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/302
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method is provided for contactless testing of an integrated circuit by fabricating, integrally with the integrated circuit, semiconductor switch elements, that is, thyristors, transistors and combinations thereof, that are connected to power and/or signal electrical inputs of the integrated circuit. Base regions of the switch elements are selectively exposed to a fine-dimensioned electron beam to switch the elements and supply desired electrical inputs at the connected inputs of the integrated circuit. The integrated circuit can thus be selectively tested preferably by segments and modules. After testing, the switch elements are disconnected from the integrated circuit, and the integrated circuit selectively connected preferably while accommodating and passivating defective components and modules of the circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.