Method for coating lead-attached electronic device
US3958039A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 16, 1974 |
| Grant date | May 18, 1976 |
| Priority date | — |
| Expiry date | Jul 16, 1994 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S118/05
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for coating only the element of an electronic device such as resor, diode or the like having an attached lead or leads with a powder coating. In this method, the electronic device travels on conveying apparatus from one end to the other end thereof, the lead holding the electronic device stably thereon. The electronic device is preliminarily heated during said travel by a preheating furnace thereby partially melting the powder coating which is applied to said device in the following part of the travel, the partially stuck powder coating on said electronic device being cured by passing the device through a secondary heating furnace thereby making it possible to complete the coating of the powder coating on the electronic device. The electronic device is coated by passing the electronic device on the conveyer between spaced opposed rotatable porous coating members having grooves in their peripheries, rotating said coating members to pass the peripheries through powder coating material while applying a vacuum to the coating members for picking up said powder coating material in said grooves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.