Apertured semi-conductor device mounted on a substrate
US3959579A · kind A · utility
26Cited by
6References
1Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 19, 1974 |
| Grant date | May 25, 1976 |
| Priority date | — |
| Expiry date | Aug 19, 1994 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15787
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apertured wafer of semi-conductive material having at least one circuit thereon is mounted on a substrate having alternating layers of insulating and conductive material. Wiring connections between the circuit and the layers of conductive material extend through the aperture as well as over the periphery to shorten the length of the wiring connections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.