Method for making electrical lead frame devices
US3960561A · kind A · utility
16Cited by
6References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 10, 1975 |
| Grant date | Jun 1, 1976 |
| Priority date | — |
| Expiry date | Apr 10, 1995 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0156
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for making lead frame devices wherein a thin metal foil is adhered to a stiffener panel by means of a photoresist layer to enable all processing steps by which the metal foil is transformed into an appropriate and predetermined lead frame configuration. After the lead frame fabrication is completed, the photoresist is removed by suitable means and ready for application and functional use as an electronic component electrical connecting device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.