Heat-resistant adhesive lacquers as wire coatings
US3960799A · kind A · utility
7Cited by
7References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 12, 1974 |
| Grant date | Jun 1, 1976 |
| Priority date | — |
| Expiry date | Sep 12, 1994 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/93
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A heat-curable adhesive lacquer is provided which comprises: (a) a polyurethane-ester-imide having (i) terminal isocyanate groups blocked by a monohydric phenol, and (ii) free hydroxyl groups and (b) an essentially linear epoxide or polyester resin having secondary hydroxyl groups and a molecular weight of above 30,000, the lacquer achieving, on drying, a B-state which is stable on storage such that the lacquer softens again when further heat is supplied to give a cross-linked resin in the C-state, which is heat stable.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.