Flexible nontacky prepreg for bonding coils in high voltage devices and method of making said prepreg
US3960803A · kind A · utility
26Cited by
7References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 22, 1973 |
| Grant date | Jun 1, 1976 |
| Priority date | — |
| Expiry date | Jun 22, 1993 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31511
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A flexible, nontacky prepreg for use in bonding high voltage coils and inner cooling channels which comprises a fibrous mat material containing a high molecular weight epoxy and a sterically hindered anhydride. The resin comprises approximately 25 to 500% by weight of the fibrous mat material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.