Polypheylene ether-resin compositions with organopolyiloxanes having silicon-H-bonds
US3960985A · kind A · utility
23Cited by
4References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 8, 1974 |
| Grant date | Jun 1, 1976 |
| Priority date | — |
| Expiry date | Feb 8, 1994 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/905
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Thermoplastic compositions which comprise a polyphenylene ether resin, an alkenyl aromatic resin and a organopolysiloxane having Si--H bonds are disclosed. These compositions have good thermal stability in that they resist discoloration when processed in a thermal cycle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.