Method for selectively controlling plating thicknesses
US3962047A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 31, 1975 |
| Grant date | Jun 8, 1976 |
| Priority date | — |
| Expiry date | Mar 31, 1995 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S204/07
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for selectively controlling the plating thickness on opposing sides of a body is disclosed. The method comprises providing an assembly of the body to be plated, a shield having apertures therein and a sealing member between body to be plated and the shield. The sealing member has an opening to allow plating solution to reach one surface of the body to be plated and has further openings to allow gases and depleted solution to escape from the assembly. The process provides a thinner layer of plated metal on the inner surface of the body to be plated and a thicker layer in the outer surface. It is particularly useful in plating ceramic circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.