Mounting pad and semiconductor encapsulation device combination
US3962719A · kind A · utility
19Cited by
3References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 5, 1974 |
| Grant date | Jun 8, 1976 |
| Priority date | — |
| Expiry date | Dec 5, 1994 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/5313
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is a semiconductor mounting pad employing slots into which the leads projecting from a header may be inserted without passing the entire lead through the pad. Apparatus for assembling the mounting pads on standard enclosure devices is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.